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  • Silicon Nitride OFC 2027: LIGENTEC at Booth W-527, LA
Silicon Nitride OFC 2027: LIGENTEC at Booth W-527, LA

When

9 March, 2027 - 11 March, 2027    
All Day
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Where

OFC website

Event Type

  • Tradeshow
OFC

LIGENTEC brings silicon nitride OFC 2027 innovation to Los Angeles. Join us at the Los Angeles Convention Center, Booth W-527, from 9 to 11 March, to see how our ultra-low-loss Silicon Nitride Photonic Integrated Circuits (PICs) power the next generation of AI-driven optical networking.

Why OFC 2027 Matters

AI workloads keep pushing data centre infrastructure toward its power and density limits. OFC is where the optical networking industry sets its response — coherent transceivers, co-packaged optics, and the interconnect architectures that will carry 2027’s traffic growth. LIGENTEC’s pure-play foundry model gives system architects a manufacturing path that scales without redesign, from first prototype to production volume, and silicon nitride OFC 2027 is where we bring that path to the show floor.

LIGENTEC’s Silicon Nitride Platform at OFC 2027

At Booth W-527, our team showcases our proprietary SiN foundry platform addressing the constraints that define hyperscale optical networking:

  • Coherent Transceivers & Datacom: Propagation loss < 0.1 dB/cm for high-speed optical interconnects as channel counts and reach increase
  • Heterogeneous Integration: TFLN electro-optic modulators and InGaAs photodetectors co-integrated on the same low-loss SiN backbone
  • Design Enablement: A complete PDK with validated models and DRC — engineered for First Time Right results on the first tape-out
  • European Manufacturing: 100% European supply chain, automotive-qualified 200mm production with X-FAB, scaling from MPW prototype to full volume production

Visit LIGENTEC at Booth W-527

OFC draws the decision-makers shaping optical networking’s next architecture. Our team is on hand for technical discussions on heterogeneous integration, propagation loss budgets, and the path from MPW prototyping to volume manufacturing. Whether your roadmap centres on 1.6T interconnects, co-packaged optics, or next-generation coherent DSPs, our applications engineers can walk through what a SiN-based design path looks like for your system.

  • Schedule a meeting: Contact us at [email protected] to reserve a time slot
  • Visit our booth: Stop by for live demonstrations and technical discussions
  • Learn more: Explore our technology page and MPW offering

We look forward to meeting you at OFC 2027 and exploring how our Silicon Nitride platform can accelerate your next optical networking design.

Book a meeting in advance: [email protected]

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