• Technology
    • Silicon Nitride
    • TFLN and III-V
    • Publications
  • Application areas
  • Services
    • Services
    • Multiple Project Wafers ( MPW)
  • About us
    • About us
    • Quality
    • Events
    • News
    • Blog
  • Careers
  • Contact
  • Technology
    • Silicon Nitride
    • TFLN and III-V
    • Publications
  • Application areas
  • Services
    • Services
    • Multiple Project Wafers ( MPW)
  • About us
    • About us
    • Quality
    • Events
    • News
    • Blog
  • Careers
  • Contact
  • Silicon Nitride OFC 2027: LIGENTEC at Booth W-527, LA
Silicon Nitride OFC 2027: LIGENTEC at Booth W-527, LA

When

9 March, 2027 - 11 March, 2027    
All Day
Download ICS Google Calendar iCalendar Office 365 Outlook Live

Where

OFC website

Event Type

  • Tradeshow
OFC

LIGENTEC brings silicon nitride OFC 2027 innovation to Los Angeles. Join us at the Los Angeles Convention Center, Booth W-527, from 9 to 11 March. There, see how our ultra-low-loss Silicon Nitride Photonic Integrated Circuits (PICs) power next-generation AI-driven optical networking.

 

Why OFC 2027 Matters

AI workloads keep pushing data centre infrastructure toward its power and density limits. Therefore, OFC is where the optical networking industry sets its response. Coherent transceivers, co-packaged optics, and new interconnect architectures will carry 2027’s traffic growth. In addition, LIGENTEC’s pure-play foundry model gives system architects a manufacturing path that scales without redesign. It supports every stage, from first prototype to production volume. For this reason, silicon nitride OFC 2027 is where we bring that path to the show floor.

 

LIGENTEC’s Silicon Nitride Platform at OFC 2027

At Booth W-527, our team showcases our proprietary SiN foundry platform. It addresses the constraints that define hyperscale optical networking:

  • Coherent Transceivers & Datacom: Propagation loss < 0.1 dB/cm supports high-speed optical interconnects, especially as channel counts and reach increase
  • Heterogeneous Integration: TFLN electro-optic modulators and InGaAs photodetectors are also co-integrated on the same low-loss SiN backbone
  • Design Enablement: A complete PDK with validated models and DRC delivers First Time Right results, so your first tape-out succeeds
  • European Manufacturing: The supply chain is 100% European, while automotive-qualified 200mm production with X-FAB scales from MPW prototype to full volume production

 

Visit LIGENTEC at Booth W-527

OFC draws the decision-makers shaping optical networking’s next architecture. For example, our team is on hand to discuss heterogeneous integration and propagation loss budgets. We can also cover the path from MPW prototyping to volume manufacturing. If your roadmap centres on 1.6T interconnects, co-packaged optics, or coherent DSPs, our applications engineers can walk you through a SiN-based design path.

  • Schedule a meeting: Contact us at [email protected] to reserve a time slot
  • Visit our booth: Stop by for live demonstrations and technical discussions
  • Learn more: Before the show, explore our technology page and MPW offering

We look forward to meeting you at OFC 2027. Together, we can explore how our Silicon Nitride platform can accelerate your next optical networking design.

Book a meeting in advance: [email protected]

Scroll
LIGENTEC SA
CH-1024 Ecublens
Email: info@ligentec.com
Website: www.ligentec.com
NEWSROOM
NEWSLETTER
FAQ
LEGAL DISCLAIMER
PRIVACY POLICY
QUALITY
STAY TUNED
LinkedIn X (Twitter) YouTube

@2026 LIGENTEC SA