September 2026
LIGENTEC celebrates 10 years of PIC Innovation and unveils Next-Generation TFLN & III-V Photodetector Platform at ECOC
Marking 10 years of Silicon Nitride (SiN) PIC leadership, LIGENTEC announced its new active-passive photonic engine at ECOC in Malaga. The multi-material platform integrates high-speed Thin-Film Lithium Niobate (TFLN) modulators and III-V photodetectors onto low-loss SiN.
Built for AI interconnects, quantum computing, and optical communications, it offers >100 GHz modulation bandwidths, <2V drive voltages, and <1 dB/m propagation losses. Backed by a full PDK and 200 mm foundry partner X-FAB, it offers a seamless route from prototyping to volume manufacturing.
Visit LIGENTEC at ECOC Booth #1368 or read the full press release to learn more!
















































