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  • LIGENTEC at Laser World of Photonics 2027 – Munich
LIGENTEC at Laser World of Photonics 2027 – Munich

When

22 June, 2027 - 25 June, 2027    
All Day
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Where

Laser World of Photonics website

Event Type

  • Tradeshow

LIGENTEC is heading to Laser World of Photonics 2027.

The 28th edition of the world’s leading trade fair for photonics components, systems, and applications takes place June 22–25, 2027, at Messe München, Munich. Visit LIGENTEC Booth to see how our low-loss Silicon Nitride Photonic Integrated Circuits (PICs) power quantum computing, telecommunications, and advanced sensing applications.

Innovation at Laser World of Photonics 2027

Since 1973, Laser World of Photonics has set the standard for scale and relevance in the photonics industry. The Laser World of Photonics 2027 edition brings together suppliers, researchers, and industry decision-makers across eleven exhibition areas — from laser manufacturing and biophotonics to integrated photonics and sensor technology.

LIGENTEC showcases our pure-play Silicon Nitride foundry platform, addressing critical requirements across:

  • Quantum Technologies: Low-loss performance for quantum key distribution (QKD) and quantum computing
  • LiDAR & Sensing: High-power handling for autonomous systems and environmental monitoring
  • Space & Datacom: Propagation loss below 0.1 dB/cm for high-speed data transmission

Why Visit LIGENTEC at Laser World of Photonics 2027

Attendees get direct access to LIGENTEC’s photonics engineering team. Whether you’re evaluating a platform for a first prototype or scaling to volume, our booth covers the full Lab to Fab path.

MPW and Volume Manufacturing

Our Multi-Project Wafer (MPW) services deliver cost-effective, rapid prototyping — validate your design before committing to a dedicated run. For projects moving to production, our Volume Manufacturing capabilities, run on an automotive-qualified 200mm line with X-FAB, hold high yield at scale.

Technical Discussions On-Site

Our engineering team is available at the booth to discuss:

  • Reducing propagation loss in complex circuits
  • Thick nitride layers for dispersion engineering
  • Integrating active components — TFLN modulators, InGaAs photodetectors — on our passive SiN platform

Connect With LIGENTEC in Munich

Find the LIGENTEC team at our Booth, Messe München, June 22–25, 2027.

Book a dedicated meeting slot: [email protected].

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