Next-Gen Tumor Detection: Silicon Nitride Photonic Integrated Circuits Medical Diagnostics at Scale
- On 15 October, 2025
The next generation of medical diagnostics—from catching tumors at their earliest stages to continuous health monitoring—relies on a technology most patients will never see: photonics. By using light instead of electronics to probe biological tissue, these devices achieve sensitivity and precision that traditional methods can’t match.
As a key partner in the European PhotonMed project, LIGENTEC is building the optical foundation that makes these breakthroughs possible. Our specialty is Silicon Nitride Photonic Integrated Circuits (PICs)—sophisticated optical chips that guide and process light with remarkably low losses, enabling medical devices to penetrate deeper, resolve finer details, and deliver diagnoses faster.
The Integration Challenge
Creating medical-grade photonic devices requires combining passive optical waveguides with active components like lasers and detectors—technologies with incompatible manufacturing requirements. This integration challenge has kept advanced photonics confined largely to research labs.
We’re developing manufacturing processes that solve this integration challenge at industrial scale, delivering research-grade performance in devices that can be produced reliably and affordably. Our work in PhotonMed is expected to generate €1M in additional annual revenue and support four new positions by 2027, while shortening the path from breakthrough to bedside for critical medical technologies.
Technical Innovation
Optimized SiN Platform: Medical imaging applications like Swept-Source Optical Coherence Tomography (SS-OCT) operate around 1.3 μm wavelength. We’ve developed an intermediate SiN thickness (350 nm) that delivers exceptional light confinement and ultra-low propagation losses critical for imaging depth and signal quality. Our manufacturing process uses LPCVD on 200mm wafers with comprehensive quality controls built in.
Heterogeneous Integration: We use Micro-Transfer Printing (μTP) to precisely place III-V semiconductor chiplets onto our SiN platform. Our engineered interface includes an integrated higher-index layer that overcomes the material mismatch, keeping coupling losses below 1 dB—critical for maintaining signal integrity. This hybrid approach enables InP/Si tunable lasers spanning 1300-2000nm for spectroscopic sensing.
Clinical Validation: In the SCIN pilot case, our SiN devices integrated with Micro-Transfer Printed InP chips form the heart of an SS-OCT system for early tumor detection—a working demonstration that our technology meets real clinical requirements.
Manufacturing at Scale
We’re advancing our platform to Technology Readiness Level 5 (TRL5), where technology transitions from lab prototype to industrial product. Our Process Design Kit (PDK) for O-band applications gives customers design tools that lower barriers to adoption, while our quality processes meet medical device regulatory requirements from the ground up.
PhotonMed validates research through 16 pilot cases led by companies building actual products, channeling Europe’s research strength into manufacturing capability and creating clear paths to market.
Working with LIGENTEC
Medical Device Companies: Tested photonic building blocks with known performance characteristics and streamlined back-end integration.
Researchers: Open-access PDK and pilot line support to jump from lab results to manufacturable prototypes.
Strategic Partners: Demonstrated position in Europe’s photonics infrastructure with proven commercial viability.
Let’s Talk
Curious about PhotonMed’s vision? Visit the project objectives page.
Ready to explore our capabilities? Check out our technology page.
