LIGENTEC is offering photonic chip related services to make your chip more efficient. Services range from design support before fabrication to characterization of the chips and packaging of selected chips after fabrication. We work closely with our partner VLC Photonics to provide you the best customer support.
We offer optical characterization of your PICs ranging from transmission measurements, advanced metrology scale dispersion and optical loss measurements.
We provide customer solution of fiber to chip packaging. We can offer prototype solutions and have partners to scale up the packaging for high volumes of silicon nitride PICs.