LIGENTEC: Advanced PIC Testing

In this interview, Antoine Brimont, Characterization Team Lead at LIGENTEC, discusses the company’s enhanced cleanroom testing capabilities. The addition of a new cleanroom and state-of-the-art equipment allows LIGENTEC to test and optimize photonic integrated circuits (PICs) with improved precision and efficiency. These advancements ensure the highest standards of performance for LIGENTEC’s cutting-edge solutions and drive innovation.

What are your key responsibilities at LIGENTEC?

I lead a team that conducts rigorous optical and electrical measurements on our PICs. We develop and optimize testing protocols, collaborate with R&D and production, and work closely with customers to tailor testing solutions to their specific needs.

What exciting projects are you currently working on?

We are significantly expanding our testing capabilities with a new cleanroom and state-of-the-art equipment. This will enhance efficiency, improve quality control, and allow us to offer a more comprehensive service to our customers, supporting them throughout their product lifecycle. We are also collaborating with key industry partners to explore new applications for our technology, such as quantum computing, automotive, 6G networks, biosensing, and chip-scale atomic clocks.

Can you describe LIGENTEC’s new photonic device testing capabilities?

Our facility is equipped with ficonTEC‘s advanced systems, enabling automated electrical, optical, and electro-optical characterization of our PICs. These systems support wafer-level testing, singulated device validation, and packaged assembly testing, with key capabilities including automated PIC visual inspection and sorting, spectral analysis, and near- and far-field testing.

How do these capabilities enhance PIC performance and reliability?

Comprehensive in-house testing ensures our PICs meet stringent performance criteria. Automated measurements validate optical loss, modulation response, and overall functionality with high accuracy. Our data tracking systems monitor performance trends, ensuring continuous improvement and high yield.

How does LIGENTEC address the challenges of testing increasingly complex PICs?

We leverage ficonTEC‘s flexible and scalable test solutions, enabling us to adapt to evolving device architectures. Automated systems ensure precision and repeatability, while a data-driven approach optimizes yields and identifies potential issues early in the process.

What are the benefits of in-house testing compared to outsourcing?

In-house testing provides greater flexibility and control, enabling faster turnaround times, more iterative testing cycles, and the ability to quickly address challenges. This improves efficiency and ensures customers receive high-quality products tailored to their exact specifications.

How do you see LIGENTEC’s testing capabilities evolving in the future?

We anticipate a growing need for higher levels of automation and parallel testing. To further improve accuracy and efficiency, we are investing in new technologies, including AI-driven analytics and machine learning for data processing. Additionally, we will expand our capabilities to accommodate new applications and materials.

How does this investment align with LIGENTEC’s mission and vision?

By ensuring we can provide the highest quality PICs, this investment enables us to support our customers in pushing the boundaries of photonic technology and bringing innovative solutions to market.