Typical turnaround time is three to four months from tape-out to chip delivery.
This includes wafer fabrication, dicing, quality control, and shipment. The exact schedule depends on the selected platform and any packaging or post-processing requirements.
LIGENTEC runs approximately 15 MPW shuttle runs per year across AN150, AN350, AN800, and MPW-LN platforms, providing regular opportunities for prototyping and design iteration. Customers who miss a tape-out deadline can typically join the next scheduled run for their chosen platform.
For customers requiring greater scheduling flexibility, faster access, or higher-volume production, dedicated wafer runs are available.
To maximize the likelihood of meeting a targeted shuttle, customers should run the local PDK DRC before submission and complete LIGENTEC’s official DRC review as early as possible. This helps ensure a smooth tape-out process and avoids delays caused by design-rule violations.
Book a platform consultation or request the PDK: [email protected]