Combining materials for full-function photonic systems
No single photonic material does everything well. Heterogeneous integration combines two or more materials on a single chip to access the best of each: SiN for ultra-low-loss passive routing and nonlinear functions; TFLN for high-speed, low-voltage electro-optic modulation (>100 GHz bandwidth, low VπL); III-V semiconductors and InGaAs for light generation and photodetection.
LIGENTEC pursues this through LIGENTEC LABS. Current offerings: TFLN modulator integration (MPW-LN and dedicated runs) and InGaAs photodetector (Die-attached or micro-Transfer Printing) integration (MPW-AN800 and MPW-AN350 runs).
Besides, LIGENTEC’s long-standing partnership with X-FAB, established in 2020, was expanded in 2025–2026 to provide customers access to X-FAB’s XPH90 SOI platform, with LIGENTEC acting as the primary customer interface.
Customers with integration requirements beyond the standard SiN core platform can access early-stage capability through LIGENTEC LABS. Design requirements entered now shape process development priorities.
Book a platform consultation or request the PDK: [email protected]
See also: SiN · AN800 · LIGENTEC LABS · X-FAB