LIGENTEC fabricates SiN waveguide chips with core thicknesses from 150 nm (AN150) to 800 nm (AN800). The PDK supports a range of fabrication modules: thermo-optic heaters (P1, Pπ < 15 mW) for phase tuning; spot size converters to SMF fibres (ExSpot, < 1 dB/facet); local cladding removal for evanescent-field sensing or material integration (LoCA); multi-level photonic circuits (X2); partial waveguide etching for polarisation management and advanced gratings (RIB); and heterogeneous integration modules for TFLN modulators and InGaAs photodetectors via LIGENTEC LABS. Reference designs include ultra-low-loss spirals, MZIs, MMIs, ring resonators, crossings, polarization management components, metal structures.
Book a platform consultation or request the PDK: [email protected]
See also: AN800 · AN350 · AN150 · TFLN · PDK · LIGENTEC LABS