Beyond the chip
- Optical coupling: LIGENTEC supports coupling to standard SMF fibres with < 1 dB/facet insertion loss via spot size converters (ExSpot module). Fibre array unit (FAU) attachment for edge and surface coupling is possible through external packaging houses.
- Thermo-optic tuning: AN800 and AN350 include high-efficiency heater modules (P1, Pπ < 15 mW) for phase tuning. Electrical connections for heater pads are defined in the PDK.
- Packaging: While LIGENTEC does not provide in-house packaging, we can connect clients with expert packaging facilities.
- Testing: Standard test reports — including optical and morphological measurements and process control monitor (PCM) data — are included with every chip delivery, confirming the fabrication batch met process specification. Custom test protocols (frequency comb threshold, coherence measurements, biosensing sensitivity) can be defined with LIGENTEC’s testing team.
Specify packaging requirements at tape-out submission, not after delivery. Last-minute changes extend delivery time and may fall outside the shuttle cycle.
Book a platform consultation or request the PDK: [email protected]