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  • PIC Summit USA 2027 — Meet LIGENTEC’s CEO and CCO in Sunnyvale
PIC Summit USA 2027 — Meet LIGENTEC's CEO and CCO in Sunnyvale

When

1 February, 2027    
All Day
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Where

PIC Summit USA

Event Type

  • Conference

LIGENTEC CEO Thomas Hessler and CCO Michael Geiselmann attend PIC Summit USA 2027 at the Plug and Play Tech Center in Sunnyvale on 1 February 2027. Meet Europe’s pure-play Silicon Nitride photonic foundry and plan your roadmap, from first Multi-Project Wafer (MPW) prototype to 200mm volume production.

Event Details

  • Date: 1 February 2027
  • Event type: Conference
  • Location: Plug and Play Tech Center, Sunnyvale, California
  • LIGENTEC attendees: Thomas Hessler (CEO), Michael Geiselmann (CCO and Co-Founder)

Why PIC Summit USA 2027 Matters for Your Photonic Integrated Circuit Roadmap

PIC Summit USA brings together senior decision-makers, technology leaders, and founders who advance photonic integrated circuit (PIC) technology. PhotonDelta and Plug and Play host the event, which connects North America’s silicon photonics ecosystem with global markets.

The programme combines expert talks, networking breaks, a walking dinner, and a live preview of showcased innovations. You meet your peers face to face and shape the next phase of integrated photonics.

Meet LIGENTEC’s Leadership in Sunnyvale

Our CEO and CCO attend together. You get the strategic and the commercial view in one conversation.

→ Thomas Hessler, CEO: foundry strategy, European supply chain, long-term capacity
→ Michael Geiselmann, CCO and Co-Founder: MPW access, volume agreements, customer roadmaps

Michael co-founded LIGENTEC in 2016 as an EPFL spin-off. He speaks to every stage, from the first prototype run to production.

Book a meeting: [email protected] · Explore our silicon nitride technology

Silicon Nitride PICs from Prototype to Volume — What to Discuss

Bring your hardest design constraint. We map it against our platform.

→ Performance: the lowest propagation loss in production
→ Completeness: SiN, Thin Film Lithium Niobate (TFLN) modulators, and InGaAs photodetectors on one platform
→ Scale: the same automotive-qualified fab with X-FAB, from MPW to 200mm production

This platform serves silicon nitride quantum photonics, silicon nitride LiDAR and sensing, and datacom. Our MPW runs let you validate a design before you commit to a dedicated wafer lot. Explore our MPW services.

Register for PIC Summit USA 2027

Register through the official PIC Summit site. Direct event questions to [email protected]. To meet LIGENTEC in Sunnyvale, email [email protected] and reserve your slot early.

Register now

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