LIGENTEC will exhibit at PIC International 2027 — the longest-running conference dedicated to photonic integrated circuits, bringing together the full PIC supply chain, from materials and equipment suppliers to foundries, packaging houses, and OEMs. Join us 13–14 April 2027 in Brussels, Belgium, at Booth 16 to explore how our ultra-low-loss Silicon Nitride Photonic Integrated Circuits (PICs) power the next generation of quantum, telecom, sensing, and space applications.

Why PIC International 2027 Matters

Now in its 12th edition, PIC International connects the full PIC supply chain under one roof. The 2027 event brings together around 40 speakers from industry and academia across five themes: industrialisation and global scaling of photonics, bridging the gap between innovation and adoption, photonics as an enabling platform across industries, evolution of the photonics value chain, and standards and commercial readiness.

PIC International is part of AngelTech, co-located with CS International, PE International, and AP International — drawing over 850 attendees, 80+ exhibitors, and 120+ presentations across the three-day event.

LIGENTEC’s Silicon Nitride Platform at PIC International 2027

At Booth 16, our team will showcase LIGENTEC’s proprietary SiN foundry platform addressing challenges across:

• Quantum Technologies: Low-loss, coherence-preserving waveguides for QKD and quantum computing
• LiDAR & Sensing: High-power handling for autonomous systems and environmental monitoring
• Telecommunications & Datacom: Ultra-low propagation loss for high-speed optical interconnects
• Space & Biomedical: Radiation-tolerant, biocompatible platforms for demanding environments

Beyond passive waveguiding, LIGENTEC’s heterogeneous integration capabilities span TFLN electro-optic modulators and InGaAs photodetectors, each co-integrated on the same ultra-low-loss SiN platform from MPW prototype to 200mm volume production.

Why Visit LIGENTEC at Booth 16

PIC International brings together the decision-makers who define where the PIC industry scales next — foundries, packaging houses, module suppliers, and OEMs. Our team is available for technical discussions on active-passive integration, propagation loss budgets, and the path from first prototype to automotive-qualified 200mm production with X-FAB.

• Schedule a meeting: Contact us at [email protected] to reserve a time slot
• Visit our booth: Stop by for technical discussions and design consultations
• Learn more: Explore our technology page and MPW offering

We look forward to meeting you in Brussels.