This virtual event took place on January 17, 2024, organised by Photonics Spectra, and examined the latest innovations in heterogeneous integration, chip-scale packaging, and optimizing PICs for volume manufacturing.
Watch the recording of our talk about “Bridging the Gap: Scaling Low Loss Photonics Integrated Circuits for Breakthrough Applications”. In this talk, we present progress on scaling the fabrication of low loss photonics integrated circuits to volume. We discuss application spaces ranging from sensing to optical computing, including quantum computing and telecommunication, where low loss PICs are crucial to enable a technology breakthrough. Options of active integration, such as LNOI are discussed to get high speed modulation on a low loss platform relevant for applications such as quantum computing. We create the bridge from fast R&D cycles in low volume PIC fabrication through multi-project wafer runs to high volume PIC fabrication in an automotive qualified CMOS line.