Heterogeneous Photonic Integration is the cornerstone of the next era of optical communications. Join LIGENTEC at the 11th PIC International Conference in Brussels to discover how we are merging active components with low-loss Silicon Nitride (SiN) to create high-performance, scalable chip architectures.
Event Overview
- When: 20 April – 22 April, 2026
- Where: Brussels, Belgium (Sheraton Brussels Airport Hotel)
- Registration: Register for the 11th PIC International
Featured Presentation: Scaling Active-Passive Circuitry
Join Michael Geiselmann, Co-Founder and CCO of LIGENTEC, for an in-depth technical session on the evolution of chip-scale systems.
Talk Title: “Advancing Scalable Photonic Integration: Heterogeneous Integration of Active Components for Next-Generation Applications”
Track: Foundations of PIC Design: Materials, Devices, and Processes
Date/Time: Tuesday, 21 April 2026 | 09:45 CET
Abstract: This presentation explores how innovative manufacturing techniques are revolutionizing photonic integrated circuits (PICs) by combining diverse materials with active components. We demonstrate significant advances in wafer-scale assembly, enabling high-speed modulators and photodetectors on ultra-low-loss passive platforms. These developments provide the necessary performance for demanding applications in space communication, quantum technologies, LiDAR, and biosensors.
Advancing the Silicon Nitride Ecosystem
The transition toward multi-material chip platforms allows designers to bypass the limitations of traditional monolithic integration. By utilizing LIGENTEC’s proprietary Silicon Nitride process, partners can achieve waveguides with propagation losses below $0.1 \text{ dB/cm}$ while still benefiting from the high-speed functionality of integrated actives.
New Frontiers in Optical Connectivity
Our latest research and development efforts focus on several high-impact areas that will be discussed during the AngelTech summit:
- High-Speed Modulation: Integrating Thin-Film Lithium Niobate (TFLN) or Indium Phosphide (InP) on SiN for data rates exceeding 800G.
- Quantum Information Processing: Achieving high signal-to-noise ratios through superior filtering and phase control on a single chip.
- Sensing and Metrology: Developing atomic-photonic chips for high-precision sensing in compact form factors.
Meet our Chief Commercial Officer
Michael Geiselmann leads the commercial strategy for LIGENTEC SA. With a PhD from ICFO and extensive research background at EPFL in frequency combs, Michael co-founded LIGENTEC in 2016. He has been instrumental in bringing cutting-edge photonic integration to the global market, helping clients transition from initial prototyping through Multi-Project Wafer (MPW) runs to high-volume manufacturing.
Why Attend the AngelTech Innovation Summit?
PIC International is part of a larger ecosystem. In 2026, it remains the number one global event for the industry, co-located with:
- Compound Semiconductor International
- Power Electronics International
- Advanced Packaging International
Attendees gain exposure to more than 120 presentations and a vibrant exhibition hall with over 80 exhibitors. It is the only global event that bridges the gap between material suppliers, foundries, and the final OEM equipment makers.
Schedule a Consultation: Are you looking to integrate active components into your next SiN design? Michael Geiselmann will be available for private 1-on-1 meetings throughout the event. Email [email protected] to book your slot