LIGENTEC NEW WEBINAR

(Tuesday 26th May 2020 at 14:00 GMT+2)

Next LIGENTEC webinar has arrived! Save the date: on Tuesday 26th May at 14:00 GMT+2 our Application Engineer Anton Stroganov will present our new webinar:

“Linear Components and Applications of LIGENTEC Platform”.

Majority of photonics integrated circuits are based on just a few basic components (or building blocks). Though the performance that can be achieved using them relies on capabilities and intrinsic properties of the platform of choice. Learn about the benefits a thick nitride platform can bring to your PIC solution! The webinar will cover the basic building blocks, main principles and examples of applications.

This new webinar will be presented by Anton Stroganov, who holds the position of LIGENTEC Application Engineer. With a background in applied physics and photonics, he has extensive experience with all aspects of LIGENTEC platform – design, layout, fabrication, characterisation and take to market.

Subscribe to webinar here

March 2020

LIGENTEC NEW WEBINAR

March 2020

PRESS RELEASE

abstract

“NEBULA is a new ambitious EU-HORIZON2020 R&D project that was launched on 1st of January 2020, with the goal to provide the foundations for a common future-proof transceiver technology platform with ultra-high bandwidth capabilities offered by a CMOS compatible toolkit and tailored towards meeting performance, cost and energy metrics in both inter-DCI coherent and intra-DCI ASIC co-packaged optics. NEBULA is funded under the ICT-05-2019: Application driven Photonic components call and is coordinated by Aristotle University of Thessaloniki in Greece.”

Click and read the full press release here

October 2019

PIC MAGAZINE ARTICLE

“LIGENTEC grows portfolio and expands board to spur growth”

“As explained by company co-founder Dr. Michael Geiselmann, LIGENTEC has commercialized its allnitride-core technology, enabling the development of products that support Industry 4.0 and other wide-ranging applications. Photonic integration is the process of downsizing optical components typically utilizing processes and techniques that have enabled microelectronic devices such as CMOS ICs to reduce their size while increasing performance. The emergence of photonic integration techniques is built around the idea of using photons instead of electrons as the basis for future advances in datacom, telecom and new photonic computing technologies. A miniaturized footprint can make optical operations much more power efficient and cost effective to manufacture.”

Click here & read the full article here

October 11th 2019

LIGENTEC FREE WEBINAR

September 2019

September 2019

PRESS RELEASE

abstract

“LIGENTEC’s advanced heater module provides increased thermo-optical tuning and improved stability for tunable ring resonators and Mach Zehnder Interferometer (MZI). The newly available heater module is optimized for LIGENTEC’s all-nitride AN800 process with waveguides that offer low bending radii (< 0.005 dB for 10 turns of 50um radius), low coupling losses (< 1 dB/facet), low propagation losses (< 0.1 dB/cm) and high power handling (up to 10 W tested).”

Click and read the full press release here

September 2019

TOP 100

We were selected by Venture lab among the TOP100 Swiss 🇨🇭 most promising companies one more year!

May 2019

PRESS RELEASE

abstract

“Dr. Thomas Hessler brings over 20 years of experience in executive management in the high-tech B2B environment, namely photonics and sensor. After obtaining his PhD in applied optics, he started a corporate venture, leading to Axetris AG, and developed the company to a market leader for micro-optics, optical gas sensing components and specialty MEMS foundry services with applications in the automotive, medical, analytical and industrial space.”

Click and read the full press release here

May 2019

TOP 100 votation

CLICK & VOTE FOR LIGENTEC so we can qualify amongst the 100 most Swiss Innovative Companies!

March 2019

PRESS RELEASE

abstract

“Designers that use LIGENTEC AN technology will now benefit from a workflow that starts from a graphical photonic integrated circuit design and system simulation environment, which seamlessly couples to layout design tools for scripted layout design and DRC capabilities. The new workflow is based on LIGENTEC and VLC Photonics verified reference designs with the simulation software by VPI Photonics using verified measurements of fabricated chips.”

Click and read the full press release here

January 2019

FORBES ARTICLE

We are glad that FORBES magazine said so!

“The fourth industrial revolution is underway, with LIGENTEC”

abstract

” How is silicon nitride a breakthrough for integrated circuits manufacturers? Dr. Michael Zervas enlightens us: “This material allows us to create chips of unprecedented thickness. When we use photons, which mean light, loss of propagation is 10 times less important with silicon nitride than with other materials. We can then miniaturize a lot of optical components and integrate them on a chip of the size of a fingertip, which is 5 times smaller than stantard integrated circuits.” This highly innovative work, provided by a team of 12 people today, has been recognized by its peers, winning this year’s Photonic Integrated Circuits Platform award at the PIC International Conference. This award recognizes advances in the development and application of key material systems driving today’s photonic integrated circuits and providing a stepping stone to future devices.”

Click and read the full article here

December 2018

PIC MAGAZINE COVER

“Award winning PIC innovation from LIGENTEC”

abstract

” As Geiselmann explained, the laboratory was developing integrated platforms with high quality resonators for nonlinear photonic applications including frequency comb generation prior to LIGENTEC’s formation. Geiselmann said these platforms started to attract a lot of interest for use in a variety of applications, so the co-founders decided to investigate the possibility of scaling up the process to make it commercially viable and offer it to researchers and the wider commercial photonics industry. He added that making the leap from lab to fab was made possible thanks to substantial commitment from Dr. Michael Zervas, another LIGENTEC cofounder, who brought his experience from Oerlikon, IBM and Intel to the Swiss startup. These abilities proved crucial in addressing commercial requirements and grappling with the many requirements new companies have to meet once they begin offering products and process solutions to commercial enterprises”

Click and read the full article here