(7th DECEMBER 2023)
In this talk, we present progress on scaling the fabrication of low loss photonics integrated circuits to volume. We will discuss application spaces ranging from sensing to optical computing, including quantum computing and telecommunication, where low loss PICs are crucial to enable a technology breakthrough. Options of active integration, such as LNOI are discussed to get high speed modulation on a low loss platform. We create the bridge from fast R&D cycles in low volume PIC fabrication through multi-project wafer runs to high volume PIC fabrication in an automotive qualified CMOS line.